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MCP14E9/10/11
1.0
ELECTRICAL
CHARACTERISTICS
? Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
Absolute Maximum Ratings ?
Supply Voltage ................................................................+20V
Input Voltage ............................... (V DD + 0.3V) to (GND – 5V)
Enable Voltage ............................ (V DD + 0.3V) to (GND – 5V)
the device at those or any other conditions above those
indicated in the operational sections of this specifica-
tion is not intended. Exposure to maximum rating
conditions for extended periods may affect device
reliability.
Input Current (V IN >V DD )................................................50 mA
Package Power Dissipation (T A = +50 o C)
8L-DFN ........................................................................ Note 3
8L-PDIP ........................................................................1.12W
8L-SOIC .....................................................................669 mW
DC CHARACTERISTICS (2)
Electrical Specifications: Unless otherwise indicated, T A = +25°C, with 4.5V ≤ V DD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘ 1 ’, High Input Voltage
Logic ‘ 0 ’, Low Input Voltage
V IH
V IL
2.4
—
1.5
1.3
—
0.8
V
V
Input Current
Input Voltage
I IN
V IN
-1
-5
—
—
1
V DD + 0.3
μA
V
0V ≤ V IN ≤ V DD
Output
High Output Voltage
Low Output Voltage
Output Resistance, High
Output Resistance, Low
Peak Output Current
V OH
V OL
R OH
R OL
I PK
V DD – 0.025
—
—
—
—
—
—
4
4
3
—
0.025
7
7
—
V
V
Ω
Ω
A
DC Test
DC Test
I OUT = 10 mA, V DD = 18V
I OUT = 10 mA, V DD = 18V
V DD = 18V (2)
Switching Time (1)
Rise Time
Fall Time
Propagation Delay Time
Propagation Delay Time
t R
t F
t D1
t D2
—
—
—
—
14
17
45
45
30
30
55
55
ns
ns
ns
ns
Figure 4-1 , Figure 4-2 ,
C L = 1800 pF
Figure 4-1 , Figure 4-2 ,
C L = 1800 pF
Figure 4-1 , Figure 4-2
Figure 4-1 , Figure 4-2
Enable Function (ENB_A, ENB_B)
High-Level Input Voltage
Low-Level Input Voltage
Hysteresis
Enable Pull-up Impedance
Enable Pin Leakage Current
Propagation Delay Time
Propagation Delay Time
V EN_H
V EN_L
V HYST
R ENBL
I ENBL
t D3
t D4
2.4
—
—
0.7
—
—
—
1.6
1.2
400
1.6
10
35
35
—
0.8
—
3.0
—
65
65
V
V
mV
M Ω
μA
ns
ns
V DD = 12V, Low-to-High Transition
V DD = 12V, High-to-Low Transition
V DD = 14V, ENBL = GND
V DD = 12V,
ENB_A = ENB_B = GND
V DD = 12V, Figure 4-3
V DD = 12V, Figure 4-3
Note 1:
2:
3:
Switching times are ensured by design.
Tested during characterization, not production tested.
Package power dissipation is dependent on the copper pad area of the PCB.
? 2011 Microchip Technology Inc.
DS25005A-page 3
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